The Finetech Blog
This is the place where we share our insights on applications and developments in die bonding and advanced packaging. Innovative technologies require creative engineering – and we’ve seen a lot of them! We hope you will learn from our experiences, and contact us with any questions.
// A Toast to Cool Customers
One of the best things about working at Finetech is we get to see some really incredible new technologies that our customers are trying to bring to market.
// Active Alignment in Photonics
With two recent optical conferences behind us (Optical Fiber Conference and Photonics West), it’s clear that one of the most intriguing applications with regard to optical device packaging and silicon
// Medical Imaging Sensor Packaging
The medical industry is experiencing exponential growth in everything sensors and the range of imaging sensors used in medical applications is wide: from extra compact cameras (i.e. for endoscopes)
// Another Year!
Wow! What a year for Finetech! In Berlin, we moved to a new, state of the art factory, introduced two NEW Die Bonders (femto 2 and sigma) and were
// Flex Circuit Bonding
We are increasingly asked about die bonding to flexible printed circuits such as chip-on-flex and flex-on-glass. Most of these inquiries come from medical companies or bio-medical researchers exploring creative
// Our New Baby!
So why has our newest family member, the FINEPLACER® sigma, shaken things up?
