How the Walther-Meißner-Institute is using a standardized Indium Bump Interconnect process on an automated FINEPLACER® femto 2 to successfully manufacture Superconducting Qubit-based Quantum Processors.
TERASi from Sweden is using a FINEPLACER® pico 2 die bonder for in-house design and manufacturing of complete modules for wireless, radar and space applications. Now, they embark upon a mission to scale their technology and bring it to mass markets.
Promex specializes in custom assembly processes for devices requiring non-electronic parts. This includes Heterogeneous Integration of MEMS, implantables and high I/O count devices e.g. for Quantum Computing, Medical Technology, Photonics, and academic research.
CSA Catapult from the UK is using a FINEPLACER® femto 2 for advanced compound semiconductor applications in markets as diverse as imaging, power electronics, optoelectronics, datacom and quantum processing.
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