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Blog

// In the Chiplet Era, Packaging Defines Performance

Chiplets are driving real products in AI, data centers, photonics, and automotive. System-in-package designs now combine logic, memory, RF, photonics, and sensors in one module. But as architectures diversify, precision in placement and bonding becomes the real differentiator. In today’s chiplet era, performance is won—or lost—at the package.

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Blog

// Perseverance through COVID-19

Perseverance is a good noun to use when speaking about 2020 thus far. This word aptly applies to Finetech’ s dedicated employees, but really the world in general. Extraordinary sacrifices have been made for the greater good. It is not over yet, surely mistakes have been made and there are lessons to be learned. However, the vast majority of our citizens have done what is thought to be the “right thing.”

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