As MEMS devices are increasingly integrated with ASICs, optics and other components, assembly becomes a defining factor for performance, yield and reliability. This article explores current trends and requirements in MEMS assembly for advanced device integration.
Ultrasonic die bonding is gaining relevance as devices grow smaller, more sensitive and increasingly diverse in their material makeup. Its speed, cleanliness and low-stress processing make it a strong fit for advanced electronics, photonics and long-lifetime applications.
Chiplets are driving real products in AI, data centers, photonics, and automotive. System-in-package designs now combine logic, memory, RF, photonics, and sensors in one module. But as architectures diversify, precision in placement and bonding becomes the real differentiator. In today’s chiplet era, performance is won—or lost—at the package.
Discover how precision packaging and die bonding solutions enable the quantum internet to scale from research to industry. Learn more about challenges, opportunities, and our role in powering quantum communication.
Integrated photonics powers innovation from data communications to quantum tech. As devices shrink, production must be faster, cost-effective, and precise. Platforms like the FINEPLACER® femto pro demonstrate how balancing speed, accuracy, and simplicity enables scalable, high-yield photonics assembly.
When a sudden US-EU tariff hike hit, Finetech had days to react—or face massive costs. Discover how fast decisions turned chaos into clarity.
As quantum technology moves from lab to market, Finetech empowers hardware innovators with precision die bonding solutions that scale from prototype to production.
At Finetech, innovation is more than building advanced machines. It’s about solving real-world problems and helping customers move faster from R&D to production.
At Finetech, sustainability is part of who we are. With our ISO 14001 certified Environmental Management System (EMS), we are actively reducing our environmental impact and aligning our operations with international best practices.
Our solutions help you streamline the transition of hybridization products from R&D to high-yield production.
