The Finetech Blog
This is the place where we share our insights on applications and developments in die bonding and advanced packaging. Innovative technologies require creative engineering – and we’ve seen a lot of them! We hope you will learn from our experiences, and contact us with any questions.
// New Production Die Bonder for High-Mix Volume Assembly
Follow the ongoing development of our next-generation production die bonder for high-mix manufacturing. This tracker collects the latest updates, engineering milestones, and insights as the platform advances with 12-inch readiness
// Plasma Treatment in Advanced Packaging: Why Clean Surfaces Decide Bond Quality
Bond quality is decided before bonding even begins. In advanced packaging, surface condition often limits yield and reliability more than placement accuracy. Plasma treatment prepares clean, stable interfaces immediately before
// Precision MEMS Assembly for Advanced Device Integration: Trends, Requirements and Practical Considerations
As MEMS devices are increasingly integrated with ASICs, optics and other components, assembly becomes a defining factor for performance, yield and reliability. This article explores current trends and requirements in
// Ultrasonic Die Bonding: Clean, Fast and Ready for the Next Generation of High-Reliability Devices
Ultrasonic die bonding is gaining relevance as devices grow smaller, more sensitive and increasingly diverse in their material makeup. Its speed, cleanliness and low-stress processing make it a strong fit
// In the Chiplet Era, Packaging Defines Performance
Chiplets are driving real products in AI, data centers, photonics, and automotive. System-in-package designs now combine logic, memory, RF, photonics, and sensors in one module. But as architectures diversify, precision
// How Packaging Precision Enables the Quantum Internet
Discover how precision packaging and die bonding solutions enable the quantum internet to scale from research to industry. Learn more about challenges, opportunities, and our role in powering quantum communication.