The Finetech Blog
This is the place where we share our insights on applications and developments in die bonding and advanced packaging. Innovative technologies require creative engineering – and we’ve seen a lot of them! We hope you will learn from our experiences, and contact us with any questions.
// Precision MEMS Assembly for Advanced Device Integration: Trends, Requirements and Practical Considerations
As MEMS devices are increasingly integrated with ASICs, optics and other components, assembly becomes a defining factor for performance, yield and reliability. This article explores current trends and requirements in
// Ultrasonic Die Bonding: Clean, Fast and Ready for the Next Generation of High-Reliability Devices
Ultrasonic die bonding is gaining relevance as devices grow smaller, more sensitive and increasingly diverse in their material makeup. Its speed, cleanliness and low-stress processing make it a strong fit
// In the Chiplet Era, Packaging Defines Performance
Chiplets are driving real products in AI, data centers, photonics, and automotive. System-in-package designs now combine logic, memory, RF, photonics, and sensors in one module. But as architectures diversify, precision
// How Packaging Precision Enables the Quantum Internet
Discover how precision packaging and die bonding solutions enable the quantum internet to scale from research to industry. Learn more about challenges, opportunities, and our role in powering quantum communication.
// Finding the Balance: Throughput, Accuracy, and Simplicity in Scalable Photonics Assembly
Integrated photonics powers innovation from data communications to quantum tech. As devices shrink, production must be faster, cost-effective, and precise. Platforms like the FINEPLACER® femto pro demonstrate how balancing speed,
// Leading Through Uncertainty: What Tariffs Taught Us About Agility
When a sudden US-EU tariff hike hit, Finetech had days to react—or face massive costs. Discover how fast decisions turned chaos into clarity.