Latest News & Press Information
Read the latest news about our product and company activities.
Finetech to Demonstrate Advanced Die Bonding Solutions at Photonics West 2025
Finetech announced its participation in Photonics West 2025, the world’s premier photonics technologies event, taking place in San Francisco from January 28-30.
Season’s Greetings from Finetech
As the holiday season approaches, we at Finetech wish to extend our warmest greetings to you and your loved ones. This festive season is a time for reflection, gratitude, and looking forward to new beginnings. Throughout the year, we have been committed to advancing the field of sub-micron die bonding,
Carlotta Baumann Wins Prestigious “EY Entrepreneur of the Year” Award 2024
Berlin, November 11, 2024 – Carlotta Baumann, CEO of Finetech GmbH & Co. KG, proudly takes home the 2024 “EY Entrepreneur of the Year” award in the Innovation category! This award honors Baumann’s outstanding commitment to innovative solutions and forward-thinking ideas that not only shape the market but also prioritize
Finetech CEO Carlotta Baumann in the Final of the “EY Entrepreneur of the Year 2024” Competition
The “EY Entrepreneur Of The Year 2024” award honors entrepreneurship and innovation in the categories of Family Business, Innovation, Sustainability, and Young Companies. Winners will be announced on November 7 at Motorwerk Berlin, recognizing outstanding business leadership and commitment.
Polar Light Technologies Partners with Finetech to Develop Next Gen MicroLED Technology
Polar Light Technologies, a leader in the development of microLED, is excited to announce a partnership with Finetech, a globally recognized supplier for sub-micron and high-accuracy die bonding solutions. The collaboration has already yielded significant advancements in micro-LED technologies for next generation AR, HUD and HMD applications. Berlin and Linköping,
Finetech to Exhibit at IEEE ESTC 2024 Conference in Berlin
From September 11-13, Finetech will be attending the 10th IEEE Electronics System Integration Technology Conference (ESTC) at the MOA Hotel in Berlin, Germany. We look forward to presenting our latest innovations in micron-scale Indium bump interconnect bonding, featuring in-situ plasma cleaning and secure material handling. From Quantum processors and µLED