Technical Papers – Bonding

Higher pixel / Qubit count and interconnect density on larger and larger chips is driving hybridization and monolithic integration. This results in increased demand for fine pitch micro Indium Bump Interconnect (IBI) flip chip die bonding solutions.

High power laser diode assembly is a mass production process. An automated laser diode bonder is expected to output complete assemblies at a high unit/hour rate, while maintaining high accuracy and high repeatability for maximum yield over a large variation in component size, and type.

Finetech's "Prototype-to-Production" approach enables fast, creative and flexible product development and seamless process transfer from R&D to production, saving you time and minimizing technological and financial risks.

This paper provides a transparent and verifiable method description of how the accuracy of Finetech placement and assembly systems is measured and specified.

Semiconductor Laser diode bars are high power products, used in places where small and efficient emitting light sources are needed. Primarily, these Lasers are being used as pumping sources for optical resonators of solid state Lasers or gas Lasers.

Optical packages are assemblies comprising optical and electronic components. Applications can be found e.g. in communication technologies where optical signals are transformed into electrical signals and vice versa.

The packaging of opto-electronic units is one of the key applications of Micro Assembly. Highly dense packaged multiplex transmitters, receivers and combined assemblies are...

Eutectic Gold/Tin (Au/Sn) is a hard solder alloy often used to bond demanding microelectronic and optoelectronic devices. They are available in different forms, such as pre-forms, solder paste or ribbons.

In order to reduce second-level packaging costs for optoelectronics manufacturing, Finetech has evaluated and is now offering an automatic solution for the packaging of CoS onto a heat sink via reactive multilayer systems (RMS).

In modern displays, Flex-on-glass and Chip-on-Glass are preferred bonding technologies. This goes along with using anisotropic conductive foils or pastes which have a fundamentally different functional principle compared to common adhesives or solder materials.

Finetech's laser-assisted bonding technology is used in C2S and C2W applications with high demands regarding speed, highest accuracy and localized heat input.

Thermocompression bonding is a quick and easy method to reliably connect flip-chips. As the name suggests, this connecting method relies on force and temperature.

An overview about different interconnects used during the system evaluation of the FINEPLACER^®  sigma

Standard IC packages with an increased number of I/O pads suffer from larger volume, increased cost, increased wire bonding resistances and parasitic inductances while offering...

This checklist helps you selecting a professional SMD rework system that suits your individual requirements.

008004 and 01005 small passive components are becoming more and more important these days (integration, miniaturization etc.). They allow particularly flat package designs when developing ultra-mobile electronic products such as functional modules,...

Finetech rework systems for R&D and production environments are well suitable for miniature LED rework, such as those in form of SMD LED components (RGB) built into modern display systems.

Precise placement of a new solder ball array is called array reballing. This repair process is applied when saving valuable resources (and money) is crucial or when the value chain has to be extended.

As the PCB market continues to be in high demand, the RF shield design will remain a challenge to rework. Simply put, the RF shield serves one goal – to minimize the Radio Frequency (RF) noise which can...

An accurate residual solder removal is an essential factor of success for most rework applications. Finetech offers contactless removal solutions for virtually all SMD components in the market.

Finetech offers a variety of equipment solutions for suitable solder paste application during the rework cycle.

Package-on-package (PoP) is an electronic circuit consisting of superposed, electrically connected assemblies. The lower module, which is the logic component, is commonly called bottom package, on top of which usually the top package module is situated.

Flexible substrates are used in 3D connection and mechatronic concepts for reducing the number of connectors needed. They can stand high dynamic bending and are capable of high speed interconnections between

The rework of BGA components with large ball arrays, processor units (CPU) as well as graphics chips (GPU) and CSP with a fine pitch array demand special device configurations that combine precise thermal management with high placement accuracy and high-resolution optics.

Flip chip components have rarely been used in PCB assembly, but they are becoming more and more important as the need for miniaturization of electronic assemblies is growing.

Flat packages such as QFNs (Quad Flat No-lead) or other MLFs (Micro Lead Frame) with outstanding thermal, inductive and capacitive characteristics (for example resulting in much shorter reaction times) are being increasingly incorporated into...

Due to their reduced space requirements, miniaturized SMD connectors are increasingly being used for small component assemblies, for example, found in mobile devices. Large SMD connectors and plugs are also widely spread.

One defect solder ball is enough to render the complete BGA package unusable. The capability to replace single solder balls allows to save particularly valuable or legacy packages.

Underfilled components are used in consumer electronic products (mobile devices, portable computers etc.), in the automotive industry (sensor modules, engine control units etc.) or whenever flip chips are incorporated in...