The All-Round Solution
Hot Air SMD Rework Station
The FINEPLACER® coreplus is a universal hot air rework station for electronic components and assemblies.
The complete rework cycle, including desoldering and soldering the component, residual solder removal and reballing, can be performed on the same compact rework system. The spectrum of compatible surface-mount devices ranges from very small (01005) to large components (BGA).
The full-area Bottom Heating Module has been optimized for reworking medium sized PCB of consumer electronics (tablets, laptops, gaming consoles) or medical technology products (i.e. MRT devices).
A pre-installed profile library and an intuitive visual user experience enables new operators to pick up work immediately. Numerous professional features, such as digital top heater calibration, precision touchdown force control and live process observation, make the FINEPLACER® coreplus a future-proof investment when the demands get tougher.
- Full hot air rework system
- Unique FINEPLACER® working principle
- Industry-leading thermal management
- In-situ process observation in HD
- Data/media logging and reporting function
- Full process access & easy visual programming with touch screen interface
- Sequence control with predefined parameters
- Placement accuracy better 10 µm
- Versatile machine platform
- Customer specific tooling
- Overlay vision alignment system (VAS) with fixed beam splitter
- 3-color LED illumination
- Full process access and easy programming
- Synchronized control of all process related parameters
- Software controlled top heater calibration
- Modular machine platform allows in-field retrofitting during entire service life
- Individual configurations with process modules
- Fully manual or semi-automatic machine versions
- Force controlled component handling
*depending on configuration
Applications & Processes
From small 008004 components to massive BGA – with a broad range of supported applications and processes, our professional SMD rework systems are ready to tackle any SMD rework challenge. With industry-leading thermal management and a modular hardware and software architecture, our SMD rework systems have been designed to yield reproducible process results for all steps of the SMD rework cycle.
Functions - Modules - Enhancements
Our die bonding solutions are as individual as our customers’ requirements and offer a wide range of configuration options. In addition to the system’s basic functions, which are part of the standard functional range, numerous process modules are available for each system, expanding the spectrum of applications. Retrofittable at any time, they enable additional die bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the die bonder easier and help to make certain technology and process sequences even more efficient.
- Bar Code Reader
Enhances the functionality of the operating software. It enables a fast and safe identification of any board based on their unique bar code label(s).
- Direct Component Printing Module
Applying solder paste made easy by printing directly on the component | An “all in one“ solution for reworking QFN, SON and MLF components
- Dispense Module
Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.
- Hot Beam 04
Infrared underheater: 500 W heating power for the efficient and precise heating of PCBs. Unique features include a very compact design, fast response and targeted heating.
- Hot Beam 05
Infrared underheater: 2,000 W heating power to heat heavy PCBs. Unique features include a very compact design, large power density and a fast response heating source.
- Hot Gas Bottom Heating Module
Local or full area bottom heater? A question of efficiency | Our approach ensures heat is provided only where it is needed to save energy and protect board and components.
- Hot Plate
HOT PLATE 04 is a powerful 700 W conductive underheater that allows efficient work on heavy electrical systems with a flat bottom surface and LED PCBs.
- Manual Dipping Unit
- MiniOven 05
The MINIOVEN 05 is a robust, compact table-top system designed for easy re-balling of BGA components and pre-bumping of QFN components.
- Presentation Module
Ensures safe handling of components from GelPak
- Process Gas Switching Module
- Process Start Sensor
Because reproducibility matters | Measures the temperature of a defined point on the board surface for reproducible process conditions.
- Reballing Module
Recycle BGA and CSP while saving time and money | Allows solder sphere arrays to be restored on custom specified BGA or CSP components after residual solder has been removed.
- Smart Desolder 01
Non-contact extraction of residual solder using a manual hot-gas source with a vacuum pen. Remove components without re-applying heat and pressure to PCB.
- Solder Removal Module
Removed in one sweep | Allows precise residual solder removal in an inert atmosphere*. Molten solder is easily removed from the board with powerful vacuum without disturbing any pads or solder resist.
- Split Field Optics
For a precise alignment of large components via edges | Allows two opposite corners of a large component and its corresponding pad area on the substrate to be viewed under high magnification.
- Substrate Heating Module
Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration. Used e.g. for thermocompression, thermal adhesive or thermosonic bonding.
- Substrate Support
Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.
- Target Finder
A small red point accelerates the working flow | Enables coarse position alignment of the table to the tool with the help of a laser spot.
- Top Heating Module (Hot Gas)
Allows the heat transfer from the top with hot gas and chip specific tool design to control temperature from the chip direction.
- Touch Screen
Allows the intuitive use of the software with established multi touch functions and a navigation based on real PCB images.
- Traceability Module
Automatic tracking and logging of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).
- Vision Alignment System (VAS)
Precise visual alignment of chip and substrate.
- Zoom Optics
Allows the adaptation of the Vision Alignment System for an optimized view of components and substrates
Desoldering, soldering, residual solder removal on flat panel TV PCB.
This video demonstrates a safe and easy reballing process on a FINEPLACER® hot gas rework system in order to repair a BGA component. Also included is a contactless removal of residual solder from the BGA.
Rework of GPU
Typical process steps of CPU/GPU rework. This includes pre-inspection, board preparation, profiling de-soldering the component, residual solder removal, reballing, special processes such as solder paste printing or dispensing, soldering the new/reworked component and finally the follow-up optical inspection.