The Finetech Blog
This is the place where we share our insights on applications and developments in die bonding and advanced packaging. Innovative technologies require creative engineering – and we’ve seen a lot of them! We hope you will learn from our experiences, and contact us with any questions.
// How Implantable Brain-Computer Interfaces Are Pushing the Boundaries of Precision Die Bonding
Implantable BCIs are pushing the limits of precision die bonding and advanced packaging. Explore the assembly challenges behind this emerging technology and the processes needed to turn prototypes into reliable
// Why Die Bonding Fails to Scale: How Do You Move from Prototype to Production Without Starting Over?
Avoid restarting development when scaling die bonding. Build stable, transferable processes early to reduce risk and achieve consistent yield from prototype to production.
// Stay Up to Date: What’s New in FiNEXT P3
Follow the ongoing development of our next-generation production die bonder for high-mix manufacturing. This tracker collects the latest updates, engineering milestones, and insights as the platform advances with 12-inch readiness
// Complex Microsystem Assembly at Scale: How Advanced Packaging Is Shaping the Next Generation of Production Die Bonders
As advanced packaging moves toward wafer level and higher integration density, production stability is becoming a defining capability for manufacturers scaling complex assemblies beyond R&D into reliable volume production.
// Plasma Treatment in Advanced Packaging: Why Clean Surfaces Decide Bond Quality
Bond quality is decided before bonding even begins. In advanced packaging, surface condition often limits yield and reliability more than placement accuracy. Plasma treatment prepares clean, stable interfaces immediately before
// Precision MEMS Assembly for Advanced Device Integration: Trends, Requirements and Practical Considerations
As MEMS devices are increasingly integrated with ASICs, optics and other components, assembly becomes a defining factor for performance, yield and reliability. This article explores current trends and requirements in