The Finetech Blog
This is the place where we share our insights on applications and developments in die bonding and advanced packaging. Innovative technologies require creative engineering – and we’ve seen a lot of them! We hope you will learn from our experiences, and contact us with any questions.
// Medical Imaging Sensor Packaging
The medical industry is experiencing exponential growth in everything sensors and the range of imaging sensors used in medical applications is wide: from extra compact cameras (i.e. for endoscopes) up
// Another Year!
Wow! What a year for Finetech! In Berlin, we moved to a new, state of the art factory, introduced two NEW Die Bonders (femto 2 and sigma) and were involved
// Flex Circuit Bonding
We are increasingly asked about die bonding to flexible printed circuits such as chip-on-flex and flex-on-glass. Most of these inquiries come from medical companies or bio-medical researchers exploring creative ways
// Our New Baby!
So why has our newest family member, the FINEPLACER® sigma, shaken things up?
// The Future of Finetech
Last month, I had the opportunity once again to visit our factory in Berlin, Germany. The Arizona heat in June alone is a great reason to get out of town
// Medical Device Bonding
In the high precision world of medical electronics R&D and manufacturing, placement accuracy, process flexibility and process reproducibility are critical.