The Finetech Blog
This is the place where we share our insights on applications and developments in die bonding and advanced packaging. Innovative technologies require creative engineering – and we’ve seen a lot of them! We hope you will learn from our experiences, and contact us with any questions.
// The Future of Finetech
Last month, I had the opportunity once again to visit our factory in Berlin, Germany. The Arizona heat in June alone is a great reason to get out of town
// Medical Device Bonding
In the high precision world of medical electronics R&D and manufacturing, placement accuracy, process flexibility and process reproducibility are critical.
// Small Die Bonding
At a recent conference, I was approached by two different companies that asked the same question, “what is the smallest die that can be bonded on the Finetech equipment?”.
// Sensors and Detectors Bonding
When bonding area detectors and sensor devices, many process variables come into play.
// Coplanarity in Bonding
During the IMAPS Conference and Exhibit in San Diego last month, one of the topics mentioned over and over again was coplanarity in die bonding.
// Optical Resolution for Bonding
High accuracy die placement requires precise magnification and resolution. It is nearly impossible to achieve sub-micron placement without accurate use of both of these elements.
