Latest News & Press Information

Read the latest news about our product and company activities.

Carlotta Baumann Wins Prestigious “EY Entrepreneur of the Year” Award 2024

Berlin, November 11, 2024 – Carlotta Baumann, CEO of Finetech GmbH & Co. KG, proudly takes home the 2024 “EY Entrepreneur of the Year” award in the Innovation category! This award honors Baumann’s outstanding commitment to innovative solutions and forward-thinking ideas that not only shape the market but also prioritize

Polar Light Technologies Partners with Finetech to Develop Next Gen MicroLED Technology

Polar Light Technologies, a leader in the development of microLED, is excited to announce a partnership with Finetech, a globally recognized supplier for sub-micron and high-accuracy die bonding solutions. The collaboration has already yielded significant advancements in micro-LED technologies for next generation AR, HUD and HMD applications. Berlin and Linköping,

Finetech to Exhibit at IEEE ESTC 2024 Conference in Berlin

From September 11-13, Finetech will be attending the 10th IEEE Electronics System Integration Technology Conference (ESTC) at the MOA Hotel in Berlin, Germany. We look forward to presenting our latest innovations in micron-scale Indium bump interconnect bonding, featuring in-situ plasma cleaning and secure material handling. From Quantum processors and µLED

Andreas Schmidt Takes Over as Head of Sales EMEA

After 15 years at the head of our Sales EMEA (Europe, Middle East, Africa) team, Thomas Müller is handing over responsibility to his successor Andreas Schmidt. Andreas has been with Finetech for almost two decades. He originally started as an application engineer before moving into Sales. These complementary perspectives on

Season’s Greetings from Finetech

As the holiday season approaches, we at Finetech wish to extend our warmest greetings to you and your loved ones. This festive season is a time for reflection, gratitude, and looking forward to new beginnings. Throughout the year, we have been committed to advancing the field of sub-micron die bonding,

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