Finetech proudly introduces the FINEPLACER® femto pro, the next generation in automated multi-purpose bonding technology. Engineered for high-yield and sustainable mid-volume production, this fully automatic system achieves a placement accuracy of 2.0 µm @ 3 Sigma and supports ultra-low to high bonding forces. With compatibility for a wide range of die attach technologies—including laser-assisted bonding, ultrasonic bonding, adhesive bonding, thermo-compression, eutectic, and reactive soldering—the FINEPLACER® femto pro is a powerful solution for cutting-edge assembly processes.
Designed for production users in industries such as photonics, power electronics, MEMS, and sensor assembly, the FINEPLACER® femto pro ensures cost-efficient, precise, and adaptable manufacturing. Supporting component sizes from 0.05 x 0.05 mm² to 40 x 40 mm², its fully enclosed architecture provides a cleanroom-quality process environment, shielding operators from gas, vapor, and UV exposure while maintaining stable, reproducible bonding results.
High Precision and Seamless Workflow Integration
At the core of the FINEPLACER® femto pro is a robust Vision Alignment System with advanced pattern recognition, enabling high-precision chip-to-substrate alignment for complex assembly applications. The system is powered by IPM Command, an intuitive software suite that simplifies process development, synchronized parameter control, and automated process logging, ensuring a smooth transition from development to full-scale production.
Keeping pace with modern industry standards, the FINEPLACER® femto pro supports full traceability and quality control, including MES database connectivity, remote control capabilities, and real-time process monitoring—ensuring manufacturers stay ahead in an increasingly connected production environment.
Modular, Future-Proof, and Ready for Tomorrow’s Challenges
Like all Finetech bonding systems, the FINEPLACER® femto pro is modular and upgradeable, allowing manufacturers to expand capabilities with process extension modules as technology evolves. This adaptability ensures that investments remain future-proof, providing a cost-effective, high-performance solution for an industry that demands precision, flexibility, and efficiency.
With its cutting-edge automation, versatile bonding capabilities, and seamless integration into modern production workflows, the FINEPLACER® femto pro sets a new benchmark in precision die bonding—empowering manufacturers to meet the challenges of the rapidly advancing assembly industry.
