From September 11-13, Finetech will be attending the 10th IEEE Electronics System Integration Technology Conference (ESTC) at the MOA Hotel in Berlin, Germany.
We look forward to presenting our latest innovations in micron-scale Indium bump interconnect bonding, featuring in-situ plasma cleaning and secure material handling. From Quantum processors and µLED arrays to IR thermal sensors, our technology is shaping the future of advanced products across multiple sectors.
With over 30 years of expertise in advanced packaging, our high-precision sub-micron die bonder systems support technology leaders from R&D to fully automated production. Whether you’re developing prototypes or scaling up for high-yield production, Finetech has the solutions to turn your product vision into reality.
We look forward to connecting with you in Berlin to explore how we can collaborate to bring your next-generation products to market.
About ESTC 2024
ESTC is the premier international event focused on electronics packaging and integration.
Supported by EPS – IEEE Electronics Packaging Society and IMAPS Europe, the conference covers a wide range of topics, including advanced packaging, materials, optoelectronics, assembly and manufacturing, design and modeling, power electronics, emerging systems, reliability, flexible electronics, and RF & THz packaging.
