Finetech introduces a new Plasma Treatment Module for the FINEPLACER® femto platform. Integrated atmospheric Argon plasma enables in-situ surface preparation directly inside the die bonder, supporting stable bonding conditions and scalable advanced packaging workflows.
Advanced packaging processes increasingly depend on clean, chemically stable interfaces. In many applications, bond quality is decided at the interface long before force and temperature are applied.
Hybrid and direct bonding, often combined with thermocompression or metal-to-metal diffusion, as well as soldering processes, leave little tolerance for organic residues, native oxides, or recontamination. Even minor surface defects can weaken adhesion, increase variability, or affect long-term electrical stability. As device architectures and material stacks grow more complex, reliable in-situ surface preparation has become a critical requirement in modern die bonding workflows.
Integrated Plasma Treatment Inside the FINEPLACER® femto Platform
Finetech has introduced a new Plasma Treatment Module that integrates atmospheric Argon plasma directly into the FINEPLACER® femto platform.
By embedding plasma treatment inside the die bonder, surfaces can be cleaned and activated immediately before bonding. This minimizes air exposure and reduces the risk of recontamination between preparation and assembly.
The compact module includes:
- an integrated plasma head
- dedicated control unit
- full IPM machine software integration
Low-temperature, electrically neutral Argon glow plasma enables gentle surface conditioning for sensitive semiconductor materials. Controlled chemistries such as ArO₂ and ArH₂ support organic removal and effective reduction of metal oxides on materials including copper, tin, and indium.
Improved Bonding Reliability and Scalable Workflows
Integrating plasma treatment directly into the die bonding process stabilizes critical interface conditions at the moment they matter most.
In-situ surface preparation:
- reduces handling steps
- shortens cycle time
- limits process-induced variability
Clean and consistently prepared interfaces improve bonding reliability, support repeatable results, and enable smoother scaling from feasibility and prototyping to stable production workflows.
With the Plasma Treatment Module available for the FINEPLACER® femto platform, plasma treatment becomes a controlled and repeatable part of the bonding workflow rather than a separate preparation step.
For demonstrations or technical discussions, the Finetech team is available to explain how integrated atmospheric Argon plasma can strengthen die attach processes in advanced packaging applications.
