Production Platform
for High-Mix Volume Die Bonding
Our next-generation 12-inch system unifies ultrasonic, adhesive,
and eutectic bonding to deliver stable yields, consistent quality,
and faster throughput in high-mix volume production.
Scale seamlessly from pilot to full production.
Production Platform
for High-Mix Volume Die Bonding
Our next-generation 12-inch system unifies ultrasonic, adhesive, and eutectic bonding to deliver stable yields, consistent quality,
and faster throughput in high-mix volume production.
Scale seamlessly from pilot to full production.
Powering production for leading innovators around the globe!
High-Mix. Multi-Process. Volume-Ready.
As device architectures evolve and material stacks diversify, production lines rely on multiple dedicated bonding tools. Each transfer between systems introduces variation, increases handling risk, and complicates process control.
In high-mix environments, this leads to unstable yield, longer changeovers, and limited scalability from pilot to volume production.
One Platform, Endless Production Possibilities
Your Production, Always Predictable
Hit your targets every shift with stable yields and consistent production.
12-Inch Ready
Run large wafers and mixed device types continuously while maximizing uptime.
Precision That Keeps You Ahead
3 µm placement accuracy reduces errors, boosts yield, and cuts rework.
Automation That Frees Your Team
Automated wafer loading and delicate die management frees your team for higher-value tasks.
One System, Many Processes
Switch seamlessly between bonding methods and packaging styles to meet customer demand.
Software That Works for You
Configure workflows, track production, and optimize output with minimal effort.
Complex Devices, Simplified for You
The new production die bonder supports volume manufacturing across demanding applications such as optical transceivers, LiDAR modules, radar, MEMS, power devices, photonic components, and high-density heterogeneous packages. These systems combine different materials, bonding methods, and tight alignment tolerances, making process stability as critical as precision.
Whether assembling laser diodes, bonding sensitive MEMS structures, or attaching SiC and GaN power devices, the platform delivers the accuracy, flexibility, and controlled automation required for repeatable production of complex electronic and photonic systems.
Live from the Lab: Follow along as we reach new milestones.
Complex Microsystem Assembly at Scale
Revealing Next-gen Die Bonding Solutions at Productronica 2025
Announcing Beta Prototype of Next-gen High Volume Production Machine
