Full-Cycle Solutions Partner for Quantum Technologies

Quantum technology is entering a transformative decade. According to the Quantum Technology Monitor 2025, the combined market for quantum computing, communication, and sensing could grow to $97 billion by 2035, and potentially reach $198 billion by 2040 [1]. Within this growth, quantum computing is expected to lead the way, with revenues projected to rise from approximately $4 billion in 2024 to as much as $72 billion by 2035 [2].

Advanced packaging is a critical performance driver here — requiring precise integration of diverse materials in compact architectures, with ultra-accurate signal routing and exceptional thermal stability

Advanced Packaging for Quantum Technologies

Finetech empowers with a single high-precision die bonding platform that adapts to diverse application requirements in the quantum hardware manufacturing market. Through versatile process design and flexible tooling, with fast changeover between configurations, one system supports the extreme demands across all quantum technologies.

Quantum Computing

Quantum computing requires cryogenic processor packaging with extreme low-loss performance. Techniques like indium bump interconnection and thermo-compression flip-chip bonding together with sub-micron die placement enable integration of FPAs, ASICs, photonics, and MEMS with high density and fine pitch interconnections with strict flatness and bond line control.

Quantum Communication

Quantum communications rely on precise optical packaging and photonic integration of lasers, single-photon sources and detectors using a variety of micro-assembly techniques such as adhesive bonding, ultraviolette snap curing, ultrasonic die attach and eutactic bonding, where alignment and loss reduction are critical for high speed, secure information transfer and quantum key distribution.

Quantum Sensing

Quantum sensing devices demand highly reliable packaging to preserve signal integrity and mechanical stability. For NV-based and photonic sensors, precise bonding methods enable low-stress assembly and robust interconnects.

Engineering Reliability for Quantum Packaging

Industry-leading quality

Proven >99% yield for quantum-grade devices.

Process versatility

Switch between bonding methods in hours, not days.

Cost efficiency

Reduce scrap, rework, and downtime to lower cost per bond.

High Yield

Achieve competitive UPH without sacrificing accuracy.

Modular platform design

Easily reconfigure tooling and processes for new products and customers.

Supported Bonding Technologies

Shifting to quantum applications and quantum manufacturing requires advanced assembly solutions that standard tools simply can’t match. Success depends on maintaining sub-micron accuracy at production speeds, achieving consistent, high-quality bonds for cryogenic performance, controlling cost per bond while scaling output, adapting to multiple bonding technologies for diverse quantum devices, and ensuring fast changeover and modularity to meet customer needs.

With over 30 years of expertise in advanced packaging and precision assembly, Finetech provides the equipment, tailored processes, and wide range of bonding methods needed to move from research to scalable production with reproducible results.

Indium Bump Interconnect

Thermo-Compression Bonding

Adhesive Bonding / UV Curing

Ultrasonic Bonding

Laser-Assisted Bonding / Eutectic Bonding

Standardizing Indium Interconnects for Scalable Superconducting Qubits

Superconducting quantum processors scaling past 100 qubits are manufactured at the Walther-Meißner-Institut with the trusted FINEPLACER^® femto 2, using Finetech’s Indium Bump Interconnect bonding process to deliver stable, reproducible results under extreme cryogenic conditions.

FINEPLACER^® femto 2

Advanced Sub-Micron Bonder

FINEPLACER^® lambda 2

Sub-Micron Table Top Die Bonder