Full-Cycle Solutions Partner for Quantum Technologies
Quantum technology is entering a transformative decade. According to the Quantum Technology Monitor 2025, the combined market for quantum computing, communication, and sensing could grow to $97 billion by 2035, and potentially reach $198 billion by 2040 [1]. Within this growth, quantum computing is expected to lead the way, with revenues projected to rise from approximately $4 billion in 2024 to as much as $72 billion by 2035 [2].
Advanced packaging technologies are becoming a foundational enabler for the next generation of quantum technologies, from quantum computing hardware to quantum communication and quantum sensing systems. In these systems, performance depends on ultra-precise integration of heterogeneous materials and interconnects designed for low-loss operation — incluiding cryogenic-compatible solutions where required. By combining high-density 3D packaging, advanced thermal management, and low-loss signal routing, these solutions allow quantum processors and other quantum devices to scale while maintaining coherence and reliability.
Advanced Packaging for Quantum Technologies
Finetech empowers you with high-precision die bonding platforms that adapts to diverse application requirements in the quantum hardware manufacturing market. Through versatile process design and flexible tooling, with fast changeover between configurations, one “all-in-one” system supports the extreme demands across all quantum technologies.
Quantum Computing
Quantum computing requires cryogenic processor packaging with extreme low-loss performance. Techniques like indium bump interconnection and thermo-compression flip-chip bonding together with sub-micron die placement enable integration of FPAs, ASICs, photonics, and MEMS with high density and fine pitch interconnections with strict flatness and bond line control.
Quantum Communication
Quantum communications rely on precise optical packaging and photonic integration of lasers, single-photon sources and detectors using a variety of micro-assembly techniques such as adhesive bonding, ultraviolet snap curing, ultrasonic die attach and eutectic bonding, where alignment and loss reduction are critical for high speed, secure information transfer and quantum key distribution (QKD).
Quantum Sensing
Quantum sensing devices demand highly reliable packaging to preserve signal integrity and mechanical stability. For NV-based and photonic sensors, precise bonding methods enable low-stress assembly and robust interconnects.
Engineering Reliability for Quantum Chip Packaging
Industry-leading quality
Proven >99% yield for quantum-grade devices.
Process versatility
Switch between bonding methods in hours, not days.
Cost efficiency
Reduce scrap, rework, and downtime to lower cost per bond.
High Yield
Achieve competitive UPH without sacrificing accuracy.
Modular platform design
Easily reconfigure tooling and processes for new products and customers.
Supported Die Bonding / Die Attach Technologies
Shifting to quantum applications and quantum manufacturing requires advanced packaging assembly solutions that standard tools simply can’t match. Success depends on maintaining sub-micron accuracy at production speeds, achieving consistent, high-quality bonds for cryogenic performance, controlling cost per bond while scaling output, adapting to multiple bonding technologies for diverse quantum devices, and ensuring fast changeover and modularity to meet customer needs.
With over 30 years of expertise in advanced packaging and precision assembly, Finetech provides the equipment, tailored processes, and wide range of die bonding/die attach methods needed to move from research to scalable production with reproducible results.
Indium Bump Interconnect
Thermo-Compression Bonding
Adhesive Bonding / UV Curing
Ultrasonic Bonding
Laser-Assisted Bonding / Eutectic Bonding
Standardizing Indium Interconnects for Scalable Superconducting Qubits
Superconducting quantum processors scaling past 100 qubits are manufactured at the Walther-Meißner-Institut with the trusted FINEPLACER® femto 2, using Finetech’s Indium Bump Interconnect bonding process to deliver stable, reproducible results under extreme cryogenic conditions.
Recommended Systems
FINEPLACER® femto 2
Advanced Sub-Micron Bonder
FINEPLACER® lambda 2
Sub-Micron Table Top Die Bonder
Ready to advance your quantum technologies with precision packaging?
References
[1] McKinsey & Company. The Year of Quantum: From Concept to Reality in 2025. Quantum Technology Monitor, 2025.
[2] McKinsey & Company. Quantum Technology Monitor 2025 – Market Outlook.
