2015

We are increasingly asked about die bonding to flexible printed circuits such as chip-on-flex and flex-on-glass. Most of these inquiries come from medical companies or bio-medical researchers exploring creative ways to bond bare die to flex circuits.

So why has our newest family member, the FINEPLACER® sigma, shaken things up?

Last month, I had the opportunity once again to visit our factory in Berlin, Germany. The Arizona heat in June alone is a great reason to get out of town and Germany is always enjoyable, but this year was a special trip.

In the high precision world of medical electronics R&D and manufacturing, placement accuracy, process flexibility and process reproducibility are critical.

At a recent conference, I was approached by two different companies that asked the same question, “what is the smallest die that can be bonded on the Finetech equipment?”.

When bonding area detectors and sensor devices, many process variables come into play.