Customer Stories
All around the world, customers rely on Finetech’s expertise. Working in close partnership, we create solutions that make a difference.
Manufacturing Superconducting Qubits for Quantum Computing via Indium Interconnect Bonding
How the Walther-Meißner-Institute is using a standardized Indium Bump Interconnect process on an automated FINEPLACER® femto 2 to successfully manufacture Superconducting Qubit-based Quantum Processors.
Building the Wireless Future – on a FINEPLACER® Die Bonder
TERASi from Sweden is using a FINEPLACER® pico 2 die bonder for in-house design and manufacturing of complete modules for wireless, radar and space applications. Now, they embark upon a mission to scale their technology and bring it to mass markets.
Empowering Promex’s Advanced Assembly with the FINEPLACER® sigma
Promex specializes in custom assembly processes for devices requiring non-electronic parts. This includes Heterogeneous Integration of MEMS, implantables and high I/O count devices e.g. for Quantum Computing, Medical Technology, Photonics, and academic research.
Pioneering Integrated Photonics Packaging with the FINEPLACER® femto 2
Based in Enschede, Netherlands, PHIX Photonics Assembly is a world leader in innovating photonic integrated circuit (PIC) assembly and manufacturing. Their goal is straightforward yet ambitious: setting new standards in the photonics industry.
Our Automated Die Bonder Enables Innovation in Compound Semiconductor Devices
CSA Catapult from the UK is using a FINEPLACER® femto 2 for advanced compound semiconductor applications in markets as diverse as imaging, power electronics, optoelectronics, datacom and quantum processing.
Hybrid integration of III-V quantum cascade lasers on silicon allows new terahertz applications
For the realization of a novel frequency comb technology, a research group from the Institute of Photonics at the Vienna University of Technology relied on flip chip and die bonding equipment from Finetech.
Automated Production of Complex Transceiver Modules
For the development and production of a particularly resilient transceiver module, Ultra Communications sought out Finetech’s high precision bonding equipment and experience with complex opto-electronics assembly.
Ultrasonic Flip Chip Bonding for Bilkent University UNAM
How Finetech assisted the National Nanotechnology Research Center (UNAM) in Turkey during the COVID-19 pandemic to retrofit and successfully deploy their existing FINEPLACER® system for a demanding ultrasonic flip-chip bonding application.
Automated Production of Diode Lasers for Medical, Industrial and Scientific Applications
With the help of a fully automated multi-chip bonder from Finetech, the Berlin-based laser specialists at Lumics have been able to improve reliability of their diode laser module manufacturing and to significantly increase production volume.
New Possibilities in R&D of Innovative MEMS Sensors
Dr. Shih-Wei Lin from the Micro Device Laboratory at NTHU, Taiwan, relies on the sub-micron die bonder FINEPLACER® lambda 2 for the development of innovative micro sensors and actuators for IoT, mobile phones and smart X.
100% Rework Success for High Value SMD Components
How AEMtec uses advanced rework technology by Finetech to repair extremely valuable SMD assemblies worth as much as a car with a 100% success rate.
Prototype to Production Assembly of Innovative Radiation Detection Products
Kromek, leading developer of radiation detection products for SPECT and more, has been using Finetech bonders in prototype & production assembly.
Die Bonder for the Stacking of Membrane Chips with One Micron Post-bond Accuracy
The Institute for Microelectronics in Stuttgart, Germany, is using a die bonder system from Finetech for the stacking of fragile membrane chips with a post-bond accuracy of less than one micrometer.
Serving the Electronic Coast®
How the University of South-Eastern Norway relies on Finetech assembly and packaging equipment to facilitate innovation in one of country’s top microtechnology regions.
The Core of Highly Flexible Rework
Siemens AG in Fürth, Germany, successfully uses the hot air rework system FINEPLACER® coreplus for rework tasks in the production of electronics for industrial applications.
Reworking Photodiode Arrays in the Manufacturing Process
How Finetech, together with First Sensor AG, developed a complete solution for reproducible rework of faulty photodiode arrays for CT detectors.
Automatic Packaging of Single Diode Lasers and Multi-Emitter Laser Modules
How Finetech supports a high power fiber laser manufacturer to implement high-accuracy assembly processes for in-house developed high power diode pumps and to transfer them from prototyping into automatic series production.
Brain Implant Gives New Hope to Epileptics
The British CANDO project develops brain implants for epileptics which could actively avoid life-threatening seizures. Measuring only few micrometers, the implants are assembled with a FINEPLACER® high-precision die bonder.
Top-tier Equipment for Top-tier Research
Finetech’s versatile flip-chip die bonder is contributing to optoelectronics research at the UK’s top engineering university.
Bright Examples of True Precision
How an Asian display manufacturer successfully improved its yield up to 100% in production of small SMD LED carrier boards by employing a Finetech-developed multi-stage rework process.
Everything at a Glance
Finetech ensures information flows right on time: Aditech’s modern LCD Displays for transportation and industrial applications are manufactured on multiple automated FINEPLACER® die bonders.
Qualified Rework of Challenging SMD Assemblies
EMS provider Mair Elektronik relies on FINEPLACER® systems for the rework of high-speed camera systems and other high-quality SMD assemblies.
High Power Laser Diodes by Quantel for Mars Rover Curiosity
High-power laser diodes by Quantel Laser help achieve important scientific tasks aboard Mars-exploring “Curiosity” rover. They were assembled on precision die bonders by Finetech.
Reliable Rework Returns
From the first to the 2000th board – Finetech designs reproducible processes for high-volume BGA rework.
