Hybrid integration of III-V quantum cascade lasers on silicon allows new terahertz applications

For the realization of a novel frequency comb technology, a research group from the Institute of Photonics at the Vienna University of Technology relied on flip chip and die bonding equipment from Finetech.

The Institute of Photonics at the Vienna University of Technology is a leader in the field of fundamental research on the generation of ultrashort high-intensity laser pulses, terahertz pulses and the realization of nano-photonic devices and their applications.

One research focus is on quantum cascade lasers (QCLs). These are compact and efficient radiation sources for the infrared and THz spectral range. Since these lasers have a broad emission spectrum, it is even possible to directly generate frequency combs, which are ideal for use in
high-resolution spectroscopy and metrology.

As part of the research on on-chip THz frequency combs, terahertz quantum cascade
lasers in the form of a ring resonator should now be combined with established silicon photonics for the first time to lay the foundation for use in numerous new fields of application.

To do this, the researchers successfully used a tabletop die bonder from Finetech.

"The FINEPLACER® lambda has created completely new possibilities for us to integrate our III-V quantum cascade lasers on a wide variety of substrates. By using the high-precision flip-chip bonder, not only the electrical contacting of thin laser geometries is no longer an issue, but also the performance of the lasers could be improved. The precision and flexibility of the FINEPLACER® lambda will also be used in future projects for the realization of lab-on-a-chip applications."
Dipl.-Ing. Dr.rer.nat. Michael Jaidl
Institute of Photonics, TU Vienna

Quantum cascade lasers (QCLs) as terahertz radiation sources.

Terahertz radiation has many potential applications. Besides spectroscopy, these include sensor technology, imaging and communication. Air monitoring with gas sensors, body scanners at airports or fast 6G data communication are just a few keywords.

However, developing efficient and compact terahertz sources has long been a challenge. Conventional methods for generating terahertz radiation, such as using femtosecond lasers, are limited in terms of power, bandwidth and efficiency.

In recent years, researchers using quantum cascade lasers (QCLs) have been able to realize reliable optical frequency comb sources in the mid-infrared and terahertz (THz) range for the first time.
 

Terahertz QCLs are lasers based on III-V semiconductor nanostructures that operate on intersubband transitions in quantum wells, enabling tunable emission wavelengths between 1 and 5 THz. As on-chip light sources, they simultaneously offer high output power, spectral control, and compact design, making them ideal candidates for portable, high-precision spectroscopic applications.

III-V THz QCL meets Silicon Photonics

Now, the Institute of Photonics at TU Wien is researching to further improve the performance, efficiency and applications of terahertz QCLs, e.g., by using new materials, geometries and integration with other platforms.

Ring resonators are particularly promising in this respect. The underlying physics of light propagation in a ring-shaped resonator leads to a high light confinement in the laser geometry. The resulting increased interaction between light and laser material leads to an efficient formation of frequency combs. Furthermore, the low radiation losses of ring resonators compared to other geometries result in lower laser threshold currents as well as lower drive currents, which leads to reduced heat dissipation of the devices (important for continuous wave high power operation).

In the study in question, the advantages of ring-shaped THz QCLs should now be combined with established silicon photonics for the first time. This would enable arbitrary THz circuit configurations such as source-waveguide-detector systems or designs with fast modulators, since plasmonic or low-loss Si waveguides can be used.

Efficient, high-power radiation sources operating at room temperature, with waveguides, detectors or modulators integrated on the same chip, would also open up countless possibilities towards lab-on-a-chip systems, e.g. for gas sensing.

High precision flip chip bonder sought and found

To build “ideal” uninterruptible ring resonators, the researchers at TU Wien used very thin ring waveguides (15 µm wide, diameter 2 mm) without their own bonding pads for electrical contact with the Si chip.
 
In the center of the ring was an additional central column, consisting of the active laser medium, which served for stabilization and heat dissipation. The distance between the ring and the column was 150 µm.
 

Due to the small size of the devices, a direct wire bonding technique for electrical contacting was not possible. And the wafer-to-wafer bonder available at the Institute of Photonics was simply not capable of handling these structures reliably either, since precise alignment of the ring to the Si chip was required.

Therefore, those responsible went in search of a flip-chip bonder that was up to the task.

After extensive research, those responsible got to know Finetech and established contact via the website. In an exchange with Finetech’s product and application experts, it quickly became clear that the FINEPLACER® lambda tabletop die bonder was a perfect fit for the application’s requirement profile thanks to its high accuracy.
 
The device enabled researchers at the institute to securely bond III-V THz QCL rings to the Ti/Au pads (10 nm/1.5 µm) of the Si chip in a flip-chip process for the first time. The protruding bridges of the Ti/Au pads and the underside of the ring substrate were used for electrical contacting.

The epi-down assembly technique using the FINEPLACER® lambda enabled increased optical confinement in the ring waveguide. An additional benefit was the improved thermal management due to the additional connections to the heat sink. Both enabled a reduced threshold current density of the laser as well as a lower heat generation of the active area during continuous wave operation, an important prerequisite for free-running frequency comb formation.

Goal of the study impressively achieved

The III-V THz QCLs integrated on silicon in the study emitted light in the 3.8 THz range and showed significantly reduced threshold current densities. In continuous wave operation, frequency comb formation was observed with a spectral bandwidth of 70 GHz. Frequency comb operation was indicated by a narrow beat signal at 8.55 GHz with a signal-to-noise ratio of up to 40 dB.
 
The study thus impressively demonstrated the potential of silicon integrated terahertz devices for practical applications and underlined the importance of efficient and compact sources for terahertz research and development.
 
The compact size and integration with the silicon substrate make the THz quantum cascade ring laser frequency comb an attractive option for use in portable and field-deployable devices, such as atmospheric sensing, materials analysis and medical diagnostics.
 

 
The die bonding technique implemented in the study with the FINEPLACER® lambda enables countless integrated on-chip applications. Due to the modular design of this technique, any waveguide geometry can henceforth be combined with light sources and detectors made of different materials and integrated into a compact lab-on-a-chip.
 
For the future, a significantly higher integration density and complexity of the setups with further increasing accuracy requirements can be expected. With the sub-micron die bonder FINEPLACER® lambda, the Institute of Photonics at TU Wien is already very well positioned for this.
 

And word of the FINEPLACER® lambda’s simple and intuitive operation, rapid readiness for use, accuracy and versatility quickly spread throughout the institute. Other research groups have long been using Finetech’s system for their own photonics research projects.

 

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