The quantum internet is moving rapidly from theory to practice. This year, the Körber Prize for European Science 2025 was awarded to German physicist and computer scientist Stephanie Wehner, professor at TU Delft and co-founder of the European Quantum Internet Alliance.
Her recognition highlights how quantum communication is shifting from research to industrial application — and why advanced quantum packaging solutions will be a cornerstone of this transformation.
What Makes the Quantum Internet Different?
Unlike classical networks that transmit information as bits (0 or 1), quantum networks exchange qubits. Qubits can exist in multiple states simultaneously and can be entangled across long distances.
These unique properties unlock new communication possibilities:
- Any attempt to intercept quantum information is immediately detectable.
- Distributed quantum computers could one day function as a single supercomputer.
In short: the quantum internet promises secure, ultra-fast communication — a leap beyond today’s digital infrastructure.
From Vision to Pilot Projects
The quantum internet is no longer just an idea. Pilot projects already exist in Europe, China, and the United States.
Milestones include:
- Secure quantum key distribution (QKD) over 100 kilometers of optical fiber
- Satellite experiments linking ground stations thousands of kilometers apart
Under Wehner’s leadership, the European Quantum Internet Alliance aims to extend quantum communication to 500 kilometers by 2030 and 1,000 kilometers by 2040. Achieving this requires breakthroughs in physics, hardware, and — critically — packaging technology for quantum devices.
Why Packaging Precision Will Make or Break Quantum Networks
Scaling quantum communication from the lab to commercial deployment depends on precision. Quantum devices such as single-photon sources, detectors, and processors are extremely sensitive. Even nanometer misalignments can cause photon loss and degrade performance.
Packaging challenges include:
- Hybrid material integration (semiconductors, superconductors, crystals, diamond, rare-earth ions)
- Cryogenic stability near absolute zero
- Reliable interconnects that withstand thermal stress
- Environmental shielding against vibration, dust, and moisture
- Scalability from manual lab setups to automated manufacturing
Without solving these challenges, the quantum internet cannot become a global infrastructure.
From Lab to Industry: Our Role in Quantum Packaging
With over 30 years of expertise in precision die bonding and advanced packaging, we provide the tools and processes to move quantum technologies from research to industrial reality.
Our die bonders like the FINEPLACER® femto 2 deliver:
- Sub-micron placement accuracy for efficient photon coupling
- Versatile bonding methods (thermo-compression, adhesive, laser-assisted, eutectic, more)
- Cryogenic-ready interconnects for millikelvin operation
- Automated, scalable platforms for reproducible high-yield results
- Industry-leading yields of over 99% for quantum-grade devices
These capabilities go beyond semiconductor standards. They enable integration of single-photon sources, superconducting circuits, and quantum detectors into scalable, reliable systems.
The Road Ahead: Scaling the Quantum Internet
Quantum technology is entering its decisive decade. The global quantum technology market is forecast to reach nearly $100 billion by the mid-2030s. Quantum communication infrastructure will be a major driver of that growth.
Advanced packaging and die bonding equipment will play a decisive role — ensuring that delicate quantum devices can be scaled, networked, and deployed in telecom and data center environments.
Our mission is to accelerate this transition by working with researchers, start-ups, and technology leaders. Together, we are building the foundation for the secure, scalable quantum internet of the future.
Meet Us at productronica 2025
We will showcase our latest quantum packaging and interconnect solutions at productronica 2025 this November.
Join us in Munich to see how our precision bonding equipment integrates delicate quantum components into scalable systems — bringing the quantum internet closer to reality.
Those who invest in advanced packaging today are shaping tomorrow’s secure, high-performance communication networks. The internet of the future will be quantum — and packaging precision will determine how fast it arrives.
