Women in the Executive Suite: Why Carlotta Baumann Was Left Stranded at the Airport

Finetech: Microsystems Technology Made in Marzahn

From a patented process to an international high-tech company: Finetech Managing Director Carlotta Baumann explains how the Berlin specialist for microsystems technology is growing with precision, in-house development, and a…

With Precision to Hidden Champion of the Semiconductor Industry

Carlotta Baumann steadily advances Finetech with a technological focus and organic growth. Published in www.unternehmeredition.de

// Who Gets to Build the Next Generation of Photonics?

The best chip doesn't decide who builds the next generation of photonics. The handoff from lab to volume does, the point where most advanced packaging quietly breaks. A look at…

// The Best Chip in the World Still Has to Be Bonded

Indium bump interconnect has quietly become the step that makes or breaks IR sensors, quantum processors and microLED displays. This blog breaks down why this one flip-chip bond now decides…

// Why Silicon Photonics Packaging Now Holds Half the Product Value

Silicon photonics packaging now carries up to half the product value. A perfect chip means nothing if the assembly around it fails. Where processes break on the way to production,…

// How Implantable Brain-Computer Interfaces Are Pushing the Boundaries of Precision Die Bonding

Implantable BCIs are pushing the limits of precision die bonding and advanced packaging. Explore the assembly challenges behind this emerging technology and the processes needed to turn prototypes into reliable…

// Why Die Bonding Fails to Scale: How Do You Move from Prototype to Production Without Starting Over?

Avoid restarting development when scaling die bonding. Build stable, transferable processes early to reduce risk and achieve consistent yield from prototype to production.

Finetech Secures Eurostars Funding to Advance Sub-micron Integration of Dual-color MicroLED Microdisplays

Finetech and Polar Light Technologies join forces to address one of the key bottlenecks in next-generation display manufacturing: the sub-micron integration of dual-color microLED devices into compact microdisplays.

// Stay Up to Date: What’s New in FiNEXT P3

Follow the ongoing development of our next-generation production die bonder for high-mix manufacturing. This tracker collects the latest updates, engineering milestones, and insights as the platform advances with 12-inch readiness…

// Complex Microsystem Assembly at Scale: How Advanced Packaging Is Shaping the Next Generation of Production Die Bonders

As advanced packaging moves toward wafer level and higher integration density, production stability is becoming a defining capability for manufacturers scaling complex assemblies beyond R&D into reliable volume production.