Author: Dan Lilie
Abstract: 008004 and 01005 small passive components are becoming more and more important these days (integration, miniaturization etc.). They allow particularly flat package designs when developing ultra-mobile electronic products such as functional modules, very small or sensitive sensors, active electronic micro implants for biomedical applications, wearables or smartphones. The major challenge in this type of rework is the size of the passive components and their respective handling. Components with the size of 0402 can be still relatively well processed with a steady hand and a microscope. Smaller components set higher requirements for placement accuracy and reproducibility which cannot be achieved by hand. Finetech offers a complete solution including component re-alignment or removal, site cleaning and optional paste application and replacement with the industries best optical resolution – incorporating real-time inspection during the process.
