The Finetech Blog
This is the place where we share our insights on applications and developments in die bonding and advanced packaging. Innovative technologies require creative engineering – and we’ve seen a lot of them! We hope you will learn from our experiences, and contact us with any questions.
// Micro Assembly Day 2018 a Success
On May 17, 2018, around 50 European professionals from industry and science followed our invitation to join the Micro Assembly Day 2018. This annual one-day conference in Berlin is a
// Is Rework a Commodity?
Finetech has been a leader in SMT Rework and Repair equipment since the company was founded more than 25 years ago. You know what’s crazy? The very first machine we
// LiDAR Everywhere!
Is it me or is everyone in technology talking about LiDAR these days? So what is it and why is everyone talking about it?
// Laser Assist and Laser Bonding
Achieving a void-free eutectic Gold/Tin (e.g. Au80Sn20) bond for laser bar bonding is a pretty straight forward process. Conventional bonders use some method of conduction to heat both the substrate
// Bonding Materials and Methods
It’s always interesting to learn about the chemistries our customers will use in next generation bonding technologies. There is so much to take into account.
// Moving from Prototype to Production
During the Fall of 2015, we introduced the FINEPLACER® femto 2 to the world – a fully automated, sub-micron die bonder which expanded our proven base model into an enclosed
