The Finetech Blog
This is the place where we share our insights on applications and developments in die bonding and advanced packaging. Innovative technologies require creative engineering – and we’ve seen a lot of them! We hope you will learn from our experiences, and contact us with any questions.
On May 17, 2018, around 50 European professionals from industry and science followed our invitation to join the Micro Assembly Day 2018. This annual one-day conference in Berlin is a
Finetech has been a leader in SMT Rework and Repair equipment since the company was founded more than 25 years ago. You know what’s crazy? The very first machine we
Is it me or is everyone in technology talking about LiDAR these days? So what is it and why is everyone talking about it?
Achieving a void-free eutectic Gold/Tin (e.g. Au80Sn20) bond for laser bar bonding is a pretty straight forward process. Conventional bonders use some method of conduction to heat both the substrate
It’s always interesting to learn about the chemistries our customers will use in next generation bonding technologies. There is so much to take into account.
During the Fall of 2015, we introduced the FINEPLACER® femto 2 to the world – a fully automated, sub-micron die bonder which expanded our proven base model into an enclosed