Author: Martin Rogge
Abstract: The packaging of opto-electronic units is one of the key applications of Micro Assembly. High-density packaged multiplex transmitters, receivers and combined assemblies are important cornerstones of recent developments in photonics, targeting high bandwidth demands. Correspondingly, highest placement accuracy is required to bond these components and various assembly technologies are utilized. This document describes some of those challenges and the solutions Finetech provides for the assembly of VCSEL and Photodiodes.
