Multi-Purpose Bonder

Motorized dipping unit for viscous materials like flux or adhesives. Suitable for use with stamping tools or for direct dipping of various sized components. Adjustable for dipping baths with different thicknesses.

Use different tools or tool tips, automatic exchange in process.

Enhances the existing bond force range and allows the use of software controlled process forces.

For determining spatial coordinates of objects to be processed using image recognition (RGB lighting).

For determining surface coordinates on the underside of captured objects using image recognition (RGB/coaxial illumination).

Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding

Allows presentation of components via Gel-Pak^®, VR trays, waffle packs or tape holders as well as the support of dipping trays.

Used to pick up components with the placement arm directly from blue tape. Supports snap rings and wafer frames.

Allows flipping of components prior to face-down assembly.

Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.

Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.

Integrated HEPA filter for cleaning the atmosphere in a closed system. Enables clean room conditions and reduces particle contamination.

Used to handle substrates or components independently from the bonding tool.

For determining heights, lengths and coordinates of objects to be processed by image recognition (RGB illumination/coaxial illumination).

Allows sensing of heights by means of Laser triangulation for measuring purposes.

For determining heights, lengths and coordinates of objects to be processed by mechanical path measurement.

Allows reading of ID codes of various types like barcodes, 2D-codes and RFIDs.

For automatic loading / unloading of substrates. Width-adjustable for various substrate dimensions.

Activation / ignition of reactive materials such as nanofoils by laser pulse.

Allows ultra-fast heat cycles du to an integrated high power laser source

Lifting objects from conveyor units into a processing position.

Manual squeegee units for viscous materials like adhesives or flux. Suitable for use with stamping tools or for direct dipping of various sized components. With adaptable layer thicknesses.

SPC (Statistical Process Control) for dispensing volumes in the automatic process flow.

Controls an inert or reactive (H2N2) atmosphere in an enclosure or with the bond head. Used to prevent or reduce oxidation during soldering or bonding.

Allows the in-situ observation of the working area during the bonding process.

Accommodates 300 mm wafer cassettes. Programmable speed and slots.

Improve the wetting condition of bonding surfaces and reduces voids. Oxide layers are scrubbed off in a low frequency mechanical sonic process.

Removed in one sweep | Allows precise residual solder removal in an inert atmosphere*. Molten solder is easily removed from the board with powerful vacuum without disturbing any pads or solder resist.

Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration. Used e.g. for thermocompression, thermal adhesive or thermosonic bonding.

Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.

Automatic tracking and logging of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).

Infeed/outfeed of objects for automatic processing in larger quantities on a minimal presentation area.

Provides ultra violet LED-light in various wave lengths for adhesive processes without thermal influence. The UV source can be attached to the tool or mounted to the substrate holder.

Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.

Special substrate heating module designed for large wafers. Very uniform heat distribution during chip to wafer or wafer to wafer bonding.