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FineXT 6003

Speed and Precision in Production

Large-Area Multi-Chip Production Die Bonder

The FineXT 6003 is a fully automatic large area production die bonder with true multi-chip, multi placement capability for high volume manufacturing.

The modular design allows to configure this production die bonder for multiple advanced packaging technologies. The machine’s capabilities can be easily enhanced to adapt to new technological trends in semiconductor manufacturing. Combined with an automatic material handling and tool management system, this ensures the production die bonder’s high degree of process flexibility for next-generation optoelectronic and demanding fan-out applications.

In operation, a speed mode and a precision mode can be flexibly combined. Given the frequently changing precision requirements during the assembly of multi-chip modules, this capability ensures optimal throughput and makes the production die bonder FineXT 6003 the perfect solution for modern semiconductor manufacturing environments.

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Key Facts*

  • Placement accuracy of 3 µm
  • Very large bond area for wafers and panels
  • Multi wafer capability
  • Automatic placement accuracy calibration
  • Fully automatic material management
  • Automatic tool management
  • Adjustable Speed for Production
  • Multi-chip capability
  • Granite base and air bearings
  • Wide range of component presentation (wafer, waffle pack, gel-pak®)
  • Modular machine platform allows in-field retrofitting during entire service life
  • Synchronized control of all process related parameters
  • Numerous bonding technologies (adhesive, soldering, thermocompression)
  • Various bonding technologies in one recipe
  • Integrated scrubbing function
  • Individual configurations with process modules
  • Process and material traceability via TCP (for MES)
  • Full process access & easy visual programming with touch screen interface
  • Data/media logging and reporting function
  • 3-color LED illumination
  • In-line capability with automatic substrate transport system

*depending on configuration

Applications & Technologies

With a broad range of supported applications and technologies, our die bonding systems are ready to tackle any application challenge in the industry. And as market requirements shift and new technologies emerge, their modular hardware and software architecture ensures maximum technological versatility over the entire service life.

Functions - Modules - Enhancements

Our die bonding solutions are as individual as our customers’ requirements and offer a wide range of configuration options. In addition to the system’s basic functions, which are part of the standard functional range, numerous process modules are available for each system, expanding the spectrum of applications. Retrofittable at any time, they enable additional die bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the die bonder easier and help to make certain technology and process sequences even more efficient.

  • Automatic Dipping Unit

    Motorized dipping unit for viscous materials like flux or adhesives. Suitable for use with stamping tools or for direct dipping of various sized components. Adjustable for dipping baths with different thicknesses.

  • Automatic Tool Changer

    Use different tools or tool tips, automatic exchange in process.

  • Automatic Tool Changer

    Use different tools or tool tips, automatic exchange in process.

  • Bar Code Reader “SmartIdent”

    Enhances the functionality of the operating software. It enables a fast and safe identification of any board based on their unique bar code label(s).

  • Bonding Force Module (automatic)

    Enhances the existing bond force range and allows the use of software controlled process forces.

  • Bonding Force Module (manual)

    Provides various bonding force ranges and allows the mechanical adjustment of different process forces.

  • Camera Module (3D)

    For determining spatial coordinates of objects to be processed using image recognition (RGB lighting).

  • Camera Module (Up-Looking)

    For determining surface coordinates on the underside of captured objects using image recognition (RGB/coaxial illumination).

  • Camera Y-Shift Module

    Allows extending the field of view in Y-direction.

  • Chip Heating Module

    Direct contact heating from the top with chip specific tool design to apply temperature from the chip side. E.g. used for thermocompression, gluing or ACA bonding

  • Component Presentation

    Allows presentation of components via Gel-Pak®, VR trays, waffle packs or tape holders as well as the support of dipping trays.

  • Die Eject Module with Carousel

    Used to pick up components with the placement arm directly from blue tape with the use of different eject tools. Supports snap rings and wafer frames.

  • Die Eject Module

    Used to pick up components with the placement arm directly from blue tape. Supports snap rings and wafer frames.

  • Die Flip Module

    Allows flipping of components prior to face-down assembly.

  • Direct Component Printing Module

    Applying solder paste made easy by printing directly on the component | An “all in one“ solution for reworking QFN, SON and MLF components.

  • Dispense Module

    Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.

  • Dual-Camera Optics

    Together with the main camera, the additional camera allows two object field sizes without zoom or different object field positions. Improves the display of large objects and thus accelerates the workflow.

  • FPXvisionTM

    Ensures a high resolution at all magnification levels.

  • Flip Chip Test Module

    The “Known Good Die" testing allows chip probing / testing prior to the bonding process.

  • Form Generator

    Software extension for creating and using virtual forms in the camera image to support relative and face-up alignment processes.

  • Formic Acid Module

    Creates an inert or reactive (CH2O2) process atmosphere. Used to reduce and prevent oxidation during soldering (e.g. eutectic or indium bonding). Add-on for Substrate Heating Modules.

  • Gap Adjustment Module

    For precisely setting a defined gap between component and substrate.

  • HEPA-Filter

    Integrated HEPA filter for cleaning the atmosphere in a closed system. Enables clean room conditions and reduces particle contamination.

  • Handling Module

    Used to handle substrates or components independently from the bonding tool.

  • Height Scanner (3D camera)

    For determining heights, lengths and coordinates of objects to be processed by image recognition (RGB illumination/coaxial illumination).

  • Height Sensor (Autofocus)

    Allows automatic focus setting of component and substrate as well as height measurements.

  • Height Sensor (Laser)

    Allows sensing of heights by means of Laser triangulation for measuring purposes.

  • Height Sensor (mechanical)

    For determining heights, lengths and coordinates of objects to be processed by mechanical path measurement.

  • High Resolution Optics

    Allows using different achromatic lenses to adapt the field of view and optical resolution.

  • I/O Lift System

    Automatic substrate or boat unloading from magazines / loading into magazines.

  • I/O Panel Handling System

    Automatic loading and unloading of large panels or substrates.

  • ID Code Reader

    Allows reading of ID codes of various types like barcodes, 2D-codes and RFIDs.

  • Indexer/Conveyor

    For automatic loading / unloading of substrates. Width-adjustable for various substrate dimensions.

  • Laser Activation Module

    Activation / ignition of reactive materials such as nanofoils by laser pulse.

  • Laser Heating Module

    Allows ultra-fast heat cycles du to an integrated high power laser source

  • Lift Station

    Lifting objects from conveyor units into a processing position.

  • Manual Dipping Unit

    Manual squeegee units for viscous materials like adhesives or flux. Suitable for use with stamping tools or for direct dipping of various sized components. With adaptable layer thicknesses.

  • Mask Generator “Scaled”

    Software extension for creating and projecting virtual masks to simplify alignment processes. These masks can be combined to scale from several objects.

  • Motorized Nick & Roll Motion
  • Motorized Z Table

    Positioning table with motorized z-travel for automatic working height adaptation; with manual x, y adjustment via micrometer screws.

  • Optics Shifting

    Allows to adjust different camera positions along the x-axis of the system. Useful to align large components with maximum magnification.

  • Overlay vision alignment system (VAS) with fixed beam splitter

    Precise visual alignment of chip and substrate.

  • Pattern Recognition

    Software tool to recognize various alignment marks. Used to control the position or alignment between component and substrate.

  • Plasma Cleaning
  • Precision Scale

    SPC (Statistical Process Control) for dispensing volumes in the automatic process flow.

  • Process Gas Module

    Controls an inert or reactive (H2N2) atmosphere in an enclosure or with the bond head. Used to prevent or reduce oxidation during soldering or bonding.

  • Process Gas Selection

    Enhances a process gas module to handle two different gases for programmed selection in the process.

  • Process Video Module

    Allows the in-situ observation of the working area during the bonding process.

  • Programmable Wafer Changer with Cassette Lift

    Accommodates 300 mm wafer cassettes. Programmable speed and slots.

  • Scrubbing Module

    Improve the wetting condition of bonding surfaces and reduces voids. Oxide layers are scrubbed off in a low frequency mechanical sonic process.

  • Solder Removal Module

    Removed in one sweep | Allows precise residual solder removal in an inert atmosphere*. Molten solder is easily removed from the board with powerful vacuum without disturbing any pads or solder resist.

  • Substrate Heating Module

    Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration. Used e.g. for thermocompression, thermal adhesive or thermosonic bonding.

  • Substrate Support

    Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.

  • Target Finder

    A small red point accelerates the working flow | Enables coarse position alignment of the table to the tool with the help of a laser spot.

    Read more (PDF, 0.3 MB)
  • Tool Tip Changer

    Use different tools or tool tips in process.

  • Traceability Module

    Automatic tracking and logging of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).

  • Tray & Tape Feeder

    Infeed/outfeed of objects for automatic processing in larger quantities on a minimal presentation area.

  • UV Curing Module

    Provides ultra violet LED-light in various wave lengths for adhesive processes without thermal influence. The UV source can be attached to the tool or mounted to the substrate holder.

  • Ultrasonic Module

    Enables ultrasonic or thermosonic bonding. Transmits mechanical energy based on lateral movement of the ultrasonic transducer to the component while it is in contact with the substrate.

  • Vacuum Chamber Module

    Enables bonding processes within a system integrated vacuum chamber. No extra handling steps and fully software controlled.

  • Wafer Changer

    Accommodates 300 mm wafer cassettes. Programmable speed and up to 24 slots.

  • Wafer Heating Module

    Special substrate heating module designed for large wafers. Very uniform heat distribution during chip to wafer or wafer to wafer bonding.

  • Wafer Table

    Automatically positions and indexes the wafer over the Die-Ejector.

  • Zoom Optics

    Allows the adaptation of the Vision Alignment System for an optimized view of components and substrates.

Technical Paper

Eutectic Bonding with Au/Sn

Eutectic Gold/Tin (Au/Sn) is a hard solder alloy often used to bond demanding microelectronic and optoelectronic devices. They are available in different forms, such as pre-forms, solder paste or ribbons.

Optical Package Assembly

Optical packages are assemblies comprising optical and electronic components. Applications can be found e.g. in communication technologies where optical signals are transformed into electrical signals and vice versa.

Laser Bar Bonding

Semiconductor Laser diode bars are high power products, used in places where small and efficient emitting light sources are needed. Primarily, these Lasers are being used as pumping sources for optical resonators of solid state Lasers or gas Lasers.
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