Author: Dan Lilie
Abstract: Rework of SMD components frequently requires the application of fresh solder paste onto the PCB pads. Industry standard is screen and stencil printing, however, due to restricted space on densely populated PCBs, this is not always a viable approach. Possible methods and solutions always have to be individually adapted to the existing conditions. Finetech offers a variety of equipment solutions for suitable solder paste application during the rework cycle.
