Author: Travis Scott, Tobias Gleichmann
Abstract: As laser technology grows and improves, so does its range of applications. From infrared to ultraviolet, lasers can be found in everything from metrology and spectroscopy, optical telecommunications, optical data processing and storage, to fibre optic communications and medical equipment. They can even be used to pump other lasers in order to achieve higher energy outputs.
Due to the high demand for laser applications, the manufacturing i.e. of high power laser diodes has become a more mainstream mass production process. Die bonding machines are required to produce large amounts of high power laser, which are expected to output complete assemblies at a high unit/hour rates as well as maintaining high accuracy and high repeatability for maximum yield over a large variation in component size, and type.
This technical paper describes a fully-automated high power laser diode assembly process, including typical process parameters, bond requirements and process steps. A specific focus of this paper is on technical and procedural solutions for the typical challenges faced during laser diode manufacturing, such as Au80Sn20 bonding quality and how this can be affected by various factors, some introduced by the bonding process and others by the materials and components themselves.
