Hot Air SMD Rework Station

Enhances the functionality of the operating software. It enables a fast and safe identification of any board based on their unique bar code label(s).

Applying solder paste made easy by printing directly on the component | An “all in one“ solution for reworking QFN, SON and MLF components

Integration of dispensing systems for applying adhesive, flux, solder paste or other pasty material. Various supported types like time-pressure, volume and jet dispensers.

Infrared underheater: 500 W heating power for the efficient and precise heating of PCBs. Unique features include a very compact design, fast response and targeted heating.

Infrared underheater: 2,000 W heating power to heat heavy PCBs. Unique features include a very compact design, large power density and a fast response heating source.

Local or full area bottom heater? A question of efficiency | Our approach ensures heat is provided only where it is needed to save energy and protect board and components.

HOT PLATE 04 is a powerful 700 W conductive underheater that allows efficient work on heavy electrical systems with a flat bottom surface and LED PCBs.

The MINIOVEN 05 is a robust, compact table-top system designed for easy re-balling of BGA components and pre-bumping of QFN components.

Ensures safe handling of components from GelPak

Because reproducibility matters | Measures the temperature of a defined point on the board surface for reproducible process conditions.

Allows the in-situ observation of the working area during the bonding process

Recycle BGA and CSP while saving time and money | Allows solder sphere arrays to be restored on custom specified BGA or CSP components after residual solder has been removed.

Non-contact extraction of residual solder using a manual hot-gas source with a vacuum pen. Remove components without re-applying heat and pressure to PCB.

Removed in one sweep | Allows precise residual solder removal in an inert atmosphere*. Molten solder is easily removed from the board with powerful vacuum without disturbing any pads or solder resist.

For a precise alignment of large components via edges | Allows two opposite corners of a large component and its corresponding pad area on the substrate to be viewed under high magnification.

Various direct contact heating options to heat up substrates from the bottom during the process. Substrate-specific fixations available. Optionally with process gas integration. Used e.g. for thermocompression, thermal adhesive or thermosonic bonding.

Unheated support plate with substrate specific fixation (e.g. vacuum) to clamp various substrates.

A small red point accelerates the working flow | Enables coarse position alignment of the table to the tool with the help of a laser spot.

Allows the heat transfer from the top with hot gas and chip specific tool design to control temperature from the chip direction.

Automatic tracking and logging of all process relevant parameters (e.g. temperature, force, etc.) as well as associated component details (e.g. serial numbers).

Precise visual alignment of chip and substrate.

Allows the adaptation of the Vision Alignment System for an optimized view of components and substrates